ICT processes and services

The processes and services undertaken by ICT at its manufacturing facility at Shepperton include:

• Micro lapping
• Micro machining
• Sputtering
• Glassing
• Wire bonding

Micro lapping

Precision lapping of small components, materials to include ceramics, ferrites and some metals such as stainless steel. We can handle small batch sizes.

During lapping, revolving flat surfaces with an abrasive lapping compound. The surface finish is controlled through applying the correct mix of abrasive, pressure and lapping cycle. Our lapping gives flat surfaces to tolerances of + 1 micron.

Micro machining State of the art wafer dicing machines capable of machining ceramics, and other materials, to tolerances at the micron level.

Sputtering RF and DC deposition of metals and insulating layers. Current capability is with titanium, platinum and gold but other materials are available on request.

Glassing

High temperature bonding of ceramics utilising glasses of various melting points.

Wire bonding

We undertake wire bonding services for our customers.